Flash is required!
BGA Ball
Flash is required!
Power Battery
> Download document

See inside with X-rays ...


Radiography is one of the oldest and most widely used methods of non-destructive testing. Radiography uses radiation energy to penetrate solid objects in order to assess variations in thickness or density, and for instance to detect cracks or other internal imperfections. The test object is placed between the radiation source and a digital detector. The image on the detector show the internal features of the test object.

Conventional 2D radiography is a shadowgraph of a 3D object, and information in depths and volume can be obtained observing the object with several orientations (angle).

Computerized Tomography (CT) improves upon conventional 2D radiography by producing 3D cross-sectional images of an object from flat x-ray images. In a CT system, the test component is placed upon a turntable stage that is between the radiation source and an imaging system. The sample is rotated during the examination, and the digital detector registers thousands of individual 2D x-ray images from all angles. An algorithm reconstructs the inner-structural image processing the data into a complete 3D representation. The characteristics of the internal structure of an object including dimensions, shape, defects, and density are readily available from the whole volume obtained.  


Radiography can be used to inspect almost any material for defects, and can also be used to locate internal features, confirm the location of hidden parts in an assembly and to measure thickness of materials.


Applications :

-          Fast production control

-          Standards : IPC A610, Mil-Std883, Esa, etc

-          Parts sorting

-          Brazing and solder pads quality (porosity, surface rate)

-          Inspection of solder joints for electronic components through and SMT (BGA, QFN, QFP, capacitors, resistance, coils…)

-          Contacts (on/off), connectors

-          Check design & assembly

-          Inclusions, heterogeneities, porosities, cracks in material (eg. ceramic)

Fields :

-          Electronic, micro-electronic

-          Medical

-          Metalworking industry

-          Mechanical parts

-          jewelry, watchmaking

-          Composite, ceramics, plastics

-          R&D



Integrity & origin of jewelry products
Exhibit News
> Oct 01 2018

ESREF 2018

European Symposium on Reliability of Electron...
> Oct 23 2018


Convergence platform for electronics,...