• Discover the new TDM Compact3 system, a powerful platform for warpage, coplanarity and thermal expansion (CTE) measurements, with resolution as low as 1µm!
    • With TDM, understand interconnect failures (BGA, CSP, PoP, etc), guaranty new component integration, validate thermomechanical models … TDM complies with standards (Jedec J-STD-020D, Jedec 22B112B)
    Contact us for further information or to schedule some tests >>>