8-12 June 2020 ANADEF Workshop French Society of Industry Experts and Scientists concerned by the failure mechanisms of electronic components and assemblies, in the aim to PREVENT, DETECT and ANALYSE Seignosse, France
27-Feb.-2020 Techinnov B2B meetings The day when all the French innovation players meet the 2,000 top French innovation decision-makers Paris La Defense
11-13/02/2020 Forum de l'électronique Salon dédié aux innovations et solutions électroniques Grenoble - Alpexpo
September 24-26 - 2019 Measurement World exhibition dedicated to measurement in its broadest sense Booth D36 PARIS EXPO PORTE DE VERSAILLES - HALL 4 - France
5-7 June 2019 JPCA trade show Japan Electronics Packaging and Circuits Association (JPCA) - Nippon Barnes booth #102 (PWB Tech area, West Hall 2) Tokyo Big Sight - Japan
4-6 June 2019 3D Print innovations and latest additive manufacturing technologies using all materials Eurexpo - Lyon - France
28 Mai 2019 Minalogic Business Meetings Grenoble WTC
22-23 Mai 2019 Minapad Grenoble - France
3-4 Avril 2019 enova Nantes Nantes
8 novembre 2018 Imaps Power 2018 Power Electronics and Packaging, Technical & International Workshop Polytech' Tours, France
8 Novembre 2018 Imaps POWER 2018 Power Electronics and Packaging, Technical & International Workshop Polyttech' Tours, France
25 octobre 2018 JRE Grenoble Journées Régionales de l'Electronique Grenoble, World Trade Center
October 23-24, 2018 ENOVA PARIS Convergence platform for electronics, measurement, vision and optics technologies, unites industry and research players on the lookout for innovative solutions for their development projects. Booth # G35 Paris Expo Porte de Versailles
1-5 October, 2018 ESREF 2018 European Symposium on Reliability of Electron Devices, Failure Physics and Analysis. JP Kummer booth #24 AALBORG, DENMARK
Atelier ANADEF Le 16e Atelier ANADEF se tiendra du 05 au 08 juin 2018, site résidentiel Club Belambra Business des "Tuquets" de Seignosse-Hossegor (Landes) Seignosse-Hossegor (Landes)
30-31 Mai 2018 ENOVA TOULOUSE 2018 Salon de l’innovation en électronique, mesure, vision et optique Parc des Expositions - Hall 1 - Stand D38
28 et 29 Mars 2018 Mesures Solutions EXPO 2018 LYON Stand A26 En partenariat avec Nikon Metrology Lyon France - Cité Centre de Congrès
8 février 2018 Techinnov Paris 2018 Journée Business et Innovation Paris - France
25-27 october 2016 SEMICON EUROPA The Largest Microelectronics Event in Europe Alpexpo, Grenoble, booth # 346 Grenoble, France
Sept. 13-15, 2016 ESTC GRENOBLE Stand 14 Grenoble, France
08 au 09 JUIN 2016 ENOVA ANGERS Stand F31 ANGERS, FRANCE
07 - 10 juin 2016 ATELIER ANADEF 4 jours de tutoriels, conférences et tables rondes sur « Les Analyses et Mécanismes de défaillance des composants pour l’électronique » Seignosse-Hossegor (Landes)
10 - 11 FEVRIER 2016 ENOVA LYON Carré Minalogic - Stand B46 LYON, FRANCE
10/11/2015 - 13/11/2015 PRODUCTRONICA Munich Messe München - Germany
April 22 - 23, 2015 MINAPAD Forum 2015 Booth 22 WTC - Grenoble, France
April 1 - 2, 2015 DeMESys Rabat Design Center, Morocco
March 17 - 19 , 2015 SEMICON China 2015 Shanghai New International Expo Centre, China
February 24 - 26, 2015 IPC APEX EXPO 2015 CONFERENCE & EXHIBITION BOOTH 339 SAN DIEGO CONVENTION CENTER CALIFORNIE USA
03/12/2014 - 05/12/2014 SEMICON Japan 2014 We are participating in SEMICON Japan 2014 Show, visit us at booth "NIPPON BARNES" our sales representantive TOKYO Big Sight - JAPAN
03/09/2014 - 05/09/2014 SEMICON Taiwan 2014 SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. TWTC Nangang Exhibition Hall, Taipei City, TAIWAN
08/07/2014 - 10/07/2014 SEMICON West 2014 SEMICON West is the first global event for the micro- and nanoelectronics industry Moscone Center, San Francisco, USA
27/05/2014 - 30/05/2014 ECTC 2014 Electronic Components and Technology Conference Lake Buena Vista, Florida, USA
21/05/2014 MINaPAD Forum 2014 Conference & Exhibition "Bringing closer the design and the semiconductor assembly & packaging communities" - Paper Presentation Insidix "Coupling of emerging inspection techniques and thermo-mechanical modeling" CEA MINATEC - Booth N°19 - Grenoble - FRANCE
18/03/2014 - 20/03/2014 SEMICON China 2014 We are participating in Semicon Shanghai 2014 Show, Pls visit us at booth no. 4743 Hall N4 Shanghai - CHINE
03/12/2013 PC2A - GRENOBLE Journée Technique : VERNIS DE TROPICALISATION CCI de Grenoble - FRANCE
01/10/2013 - 04/10/2013 ESREF 2013 24th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - stand 4 Arcachon - FRANCE
09/09/2013 - 12/09/2013 EMPC 2013 European Microelectronics and Packaging Conference - Paper "Coupling experimental and modelling results for device failure anticipation"- Booth Grenoble FRANCE
19/03/2013 - 21/03/2013 SEMICON China 2013 Shanghai China
February 6 & 7, 2013 IMAPS 2013 8th European Advanced Technology Workshop on Micropackaging and Thermal management La Rochelle France
05/12/2012 to 07/12/2012 SEMICON Japan The World Largest Exhibition for The Semiconductor Manufacturing Supply Chain Tokyo (JAPAN)
Nov 28_29 2012 15th Technical & Scientific Meeting of ARCIS Characterization methods for Microelectronics and Photovoltaics Gardanne - France
11/11/2012 to 15/11/2012 ISTFA 2012 38th International Symposium for Testing and Failure Analysis Phoenix AZ (USA)
14/10/2012 to 18/10/2012 SMTA international 2012 The Surface Mount Technology Association, developing solutions in Electronics Assembly Orlando FL (USA)
01/10/2012 to 05/10/2012 ESREF 2012 / ISROS 2012 23rd European Symposium on Reliability of Electron Devices,Failure Physics and Analysis with:3rd International Symposium on Reliability of Optoelectronics For Space (ISROS 2012) Cagliari (ITALIE)
05/09/2012 to 07/09/2012 SEMICON Taiwan 2012 A Vibrant Semiconductor Market Taipei TAIWAN
10/07/2012 to 12/07/2012 SEMICON West 2012 Semicon West is your opportunity to connect with your customers, demonstrate your market leadership, and develop partnerships. San Francisco (USA)
02/07/2012 to 06/07/2012 IPFA 2012 19th IEEE International Symposium on the physical and failure analysis of integrated circuits Singapore
04/06/2012 to 08/06/2012 ANADEF Atelier 2012 Analyses et Mécanismes de défaillance des composants pour l'électronique Seignosse (FRANCE)
03/06/2012 to 07/06/2012 ISPSD'2012 24th IEEE International Symposium on Power Semiconductor Devices and ICs Bruges (BELGIUM)
29/05/2012 to 01/06/2012 ECTC 2012 The Premier international packaging, components, and microelectronic systems technology conference San Diego (USA)
08/05/2012 to 10/05/2012 SMT/Hybrid/Packaging 2012 & PCIM 2012 SMT Hybrid Packaging is Europe´s leading event on System Integration in Micro Electronics. Nuremberg (GERMANY)
24/04/2012 to 26/04/2012 SEMICON Singapore 2012 SEMICON Singapore is Southeast Asia's premier annual event dedicated to microelectronics manufacturing Singapore
16/04/2012 to 18/04/2012 EUROSIME 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Lisbonne (PORTUGAL)
08/03/12 IMAPS journée technique: Fiabilité des composants et systèmes IMAPS Technical Exhibition day Journée technique « la Fiabilité du packaging des semiconducteurs » Bordeaux
28/02/12 to 01/03/12 APEX-IPC 2012 Advanced and Emerging technologies in printed board design and manufacturing, electronics assembly and test Booth N° 531 San Diego (USA)
01/02/2012 to 02/02/2012 IMAPS 2012 6th European Advanced Technology Workshop on Micropackaging and Thermal Management La Rochelle (FRANCE)
November 28th to December 01st Rayons X et Matière Tours
November 28th and 29th Workshop "Challenges for 3D ICs and Systems" Toulouse
November 13-17th ISTFA 2011 The ISTFA technical symposia, user groups, education opportunities and the largest equipment exposition in the industry. San Jose, California (USA)
October 20-21th GIF Innovation 2011 For its third edition Grenoble Innovation Fair is broadening its scope to cover more new or emerging innovations in Europe. Grenoble (FRANCE)
October 16-20th SMTA International 2011 The Surface Mount Technology Association, developing solutions in Electronics Assembly Fort Worth TX (USA)
October 3-6th IWLPC 2011 International Wafer-Level Packaging Conference Santa Clara CA (USA)
October 3-7th Esref 2011 This international symposium continues to focus on recent developments and future directions in Quality and Reliability Management of materials. Bordeaux (FRANCE)
July 12-14th Semicon West 2011 Semicon West is your opportunity to connect with your customers, demonstrate your market leadership, and develop partnerships. San Francisco (USA)
July 4-7th IPFA 2011 IPFA 2011 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures. South Korea
May 31st- June 3rd ECTC 2011 Electronic Components and Technology Conference Orlando FL (USA)
May 24-27th Cofrend's days Confédération Française pour les Essais Non Destructifs Dunkerque (France)
May 11-13th Semicon Singapore 2011 SEMICON Singapore is a series of informative forums simultaneously taking place right at the show floor where visitors can meet the industry leaders. Singapore
May 11-12th Minapad 2011 Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum Grenoble
May 3rd Imaps New England Packaging Symposium 2011 Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems Boxborough MA( USA)
May 3-5th SMT/Hybrid/Packaging 2011 System Integration in Micro Electronics Nuremberg (Germany)
April 17-20th Eurosime 2011 International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Linz (Austria)
April 10-14th IPC-APEX 2011 Advanced and Emerging technologies in printed board design and manufacturing, electronics assembly and test Las Vegas (USA)
April 6-7th Decielec 2011 Convention d'affaires des systèmes embarqués Congrès international de l'électronique de puissance et du management des systèmes énergétiques Tarbes (France)
March 8-10th Imaps conference on DEVICE PACKAGING 7th International Conferrence and Exhibition on device Packaging Fountain Hills (AZ, USA)
ECTC 2013 Electronic Components and Technology Conference
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Techinnov

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ANADEF Workshop

French Society of Industry Experts and Scientists...